The MOS plays a major role in keeping your filaments in good condition, by keeping the humidity levels at a minimum and actively drying them on demand.
The material operation system has three types of working modes:
| Mode | Temperature | Time | Comments |
| Silica recovery | 70º | 6h | Activated automatically when humidity>10% |
| Filament recovery | 70º | 24h | Activated through user input via filament load or omega assistant |
| Passive mode | 50º | Constant | Activated automatically when low temperature filament is loaded |
Below you can find a detailed explanation of each mode:
Silica recovery
The Silica recovery cycle runs autonomously, and its function is to keep the silica inside the MOS in good condition so that it is able to absorve moisture and keep the humidity levels below 10%.
This procedure will be activated automatically when the humidity levels inside the MOS are above 10%, first by preheating the MOS chamber to 70º, and then by drying the silica for a 6 hours period.
This cycle will be performed on the background as long as the printer is ON and will not prevent the user from running any other action on the printer.
Filament recovery
The filament recovery procedure requires user input, and should only be used when a potentially humid filament has been loaded in the printer.
It can be activated after loading a filament, from the filament load
menu (1), or at any time through the omega assistant menu (2):
In both cases, the MOS chamber will preheat to 70º and perform a drying cycle for the next 24 hours.
This procedure will be performed in the background as long as the printer is ON.
It's not recomended to print with the filament that's being dried, but the printer won't prevent the user from doing it.
The filament state will be updated on the MOS menu, with three possible options
Passsive mode
Passive mode will be automatically enabled when a low temperature filament (below 230º) is loaded in the MOS.
The goal of passive mode is to prevent the high temepratures of the silica and flament recovery cycles to damage low temperture filament. For this reason, this procedure will preheat the MOS chamber to 50º and keep it constant, to keep the conditions inside the MOS as stable as possible without compromising the filament.
Passive mode will be automatically disabled when the low temperature filament/s are unloaded.